We specialize in contract manufacturing of electronic products. From early-stage R&D support to full-scale production, our facility provides end-to-end processing through SMT, DIP, and COB bonding workshops. Each workshop plays a vital role in ensuring quality, consistency, and product performance.
SMT Production Department
Our SMT Production Department specializes in the assembly of surface-mount electronic components. It supports the development and mass production of various electronic products, particularly for clients who require high-quality, reliable contract manufacturing services. Our experienced team ensures each product is built to meet rigorous production standards.
DIP Post-Soldering Workshop
DIP (Dual In-line Package) soldering is a core process where components such as resistors, capacitors, and ICs are inserted into pre-designed holes on the PCB and soldered into place. Our DIP Post-Soldering Workshop is operated by skilled professionals who ensure stable connections and reliable assembly. This process is essential for products requiring high mechanical strength or traditional through-hole assembly.
COB Bonding Workshop
COB (Chip-on-Board) bonding is a cost-effective and efficient chip packaging solution. In this process, bare chips are placed directly onto the PCB, and wire bonding connects the wafer pads to the PCB’s gold fingers. After electrical testing, the assembly is sealed and cured with epoxy resin. Our COB Bonding Workshop is ideal for compact, high-integration electronic modules.
Real-World Applications and Product Display
We provide manufacturing support for a wide range of electronic products across various industries. The following images display actual production results from our SMT, DIP, and COB processes, showcasing our ability to deliver quality and consistency in every unit.