IoT smart appliances demand reliable links. They also require compact electronics and low power. Consequently, board design now defines device performance. High-density interconnect (HDI) PCBs answer many of those needs. They pack traces, vias, and components more tightly. As a result, signal integrity and RF performance improve. Moreover, HDI PCB lets designers place radios and […]
Solid-state drives (SSDs) require high-speed, reliable connections. Modern storage systems depend on stable signal paths and robust thermal performance. A poorly printed circuit board can cause data loss, latency, or failure. A multi-layer PCB architecture addresses these challenges by providing multiple conductive layers, improving signal integrity, and enhancing power distribution. Let’s explore how multi-layer designs […]
Set-top Box SMT assembly lines often face defects that reduce yields and increase costs. To maintain quality, identify root causes, and optimise processes. Start with PCB inspection, solder paste control, and component placement. Meanwhile, monitor reflow profiles and operator handling. Proper training and consistent procedures help prevent mistakes and also facilitate the recording of data […]
Multilayer PCBs (printed circuit boards) are crucial for high-frequency electronics due to their compact design and superior signal integrity. They play a crucial role in applications such as radio frequency communications, high-speed data transmission, and precision measuring instruments. So, how should we construct multilayer PCBs for high-frequency electronics? What key design factors, materials, and manufacturing […]
Parylene Nano Vacuum Coating provides electronics with a thin, uniform barrier that helps assemblies withstand harsh environments. In many field cases, even minor defects can cause early failures. Therefore, engineers use this coating to block moisture, contaminants, and corrosion. Moreover, it conforms to complex geometries without adding bulk. As a result, teams protect sensitive circuits […]
Selecting the appropriate dielectric material is crucial for PCBs, particularly for a high frequency PCB. You need a dielectric material with a stable dielectric constant and a low loss tangent. This is non-negotiable. If the material fails to maintain its electrical properties at high frequencies, signal degradation and electromagnetic interference (EMI) issues can occur. If […]
A robust PCB stackup starts with the appropriate number of layers, copper thickness, and proper layout of ground and power planes. Material selection is also crucial. For high-current designs, such as motor drives or inverters, thick copper PCBs are often preferred due to their ability to handle high currents. They provide a low-impedance power path […]
HDI, or High-Density Interconnect, refers to a PCB design approach that incorporates finer lines and spaces, smaller vias, and higher connection pad density. This enables more complex routing and higher component density on a smaller board area. For high-frequency designs, these characteristics are invaluable. They reduce parasitic effects, improve impedance control, and support better thermal […]
Edge Connectors play a pivotal role in electrical connectivity for a wide range of devices, especially in high-performance gold finger PCBs. These connectors are exposed to repeated insertions, environmental contaminants, and temperature fluctuations. Over time, these factors can lead to physical wear and oxidation, which in turn impact conductivity and signal integrity. Choosing the Right […]
Surface Mount Technology (SMT) has become a cornerstone of modern printed circuit board assembly (PCBA). With its ability to place components directly onto the surface of PCBs, SMT enables faster and more accurate assembly lines. This is especially important for industries requiring small, complex, and high-performance electronic devices. Furthermore, SMT allows manufacturers to reduce space […]