MZH Electronics


HDI PCB is a multi-layer circuit board with high wiring density, thin lines, spaces and micro-holes. They are designed to increase the functionality and performance of electronic products while reducing their size. High-Density Interconnect (HDI) PCBs represent technological advancements in printed circuit board design and manufacturing. These boards are known for their enhanced electrical performance and compact size.

Parameters and features:

Number of layers: HDI PCBs typically have more than two layers. Standard configurations include 4-layer, 6-layer, 8-layer, and up to 20 or more layers.

Microvias: Microvias are small, laser-drilled holes connecting different PCB layers, allowing for higher routing density.

Thin Lines/Spaces: HDI boards have narrow traces and gaps, usually measured in microns (μm). This allows for a more compact design.

Advanced Materials: HDI PCBs use advanced materials such as high-frequency laminates for optimal signal integrity and impedance control.

Aspect Ratio: Aspect ratio is the ratio of PCB thickness to microvia diameter. HDI boards usually have a high aspect ratio.

Blind and Buried Vias: These types of vias begin or end on inner layers, enhancing routing possibilities.

Via-in-Pad (VIP): This design places the via within the component bonding pad, allowing the use of smaller component sizes.


Manufacturing process:

Lamination: This process begins with heat and pressure to layer and bond thin core materials to create a multi-layer stack.

Drilling: Laser drilling and mechanical drilling can create micro vias and vias.

Copper Plating: After drilling, copper is deposited on the hole’s walls to create a conductive path.

Imaging: The photolithography process uses a layer of photoresist and ultraviolet light to define circuit patterns on each layer.

Etching: Chemically removing exposed copper, leaving the desired copper traces.

Copper Fill and Planarization: In the case of buried vias, any excess copper is filled and then planarized to create a flat surface.

Solder mask and screen printing: Solder mask insulates and protects copper traces, while screen printing adds component labels.

Surface Treatment: The surface of the PCB undergoes surface treatment such as ENIG (Electroless Nickel Immersion Gold) or HASL (Hot Air Solder Leveling).

Application areas

MZH Electronics

Contact us for the best PCB solution


    Email address*

    Telephone number


    Your needs